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Process Capability

Description:
Description:
Information
imposition size copper plating
Single panel 250mm*600mm Through hole 0.1mm
Double panel 250mm*400mm Thickness 5um-20um
Line width line spacing Tool Accuracy
Single panel 50um/50um Punching 0.03um
Double panel 50um/50um Inter-layer misalignment 0.05mm
surface treatment SMT
Electroplated nickel gold Ni: 1-8um Au: 0.025-1.25um Push and pull force 1.0kgf
Nickel gold Ni: 1-8um Au: 0.025-0.1um Minimum component 0201
Electroplating tin T=5-35um Minimum pad 0.3mm
OSP T=0.15-0.5um Accuracy ±0.05mm

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Address: No. 333 Pingshan Rd., Yangzhou City, Jiangsu Province, China

E-mail:info@ywcc.com.cn

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